Metal assisted chemical etching (MacEtch) is a recently developed anisotropic wet etching method that is capable of producing high aspect ratio semiconductor nanostructures from patterned metal film. In this review article, we highlight the characteristics of MacEtch of silicon (Si) including controllability of the produced …
In this study, super-hydrophobic coatings on Al surfaces were prepared by a two-step chemical etching process using potassium hydroxide and lauric acid as the etching solution and coating solution, respectively. The Al surface was roughened by immersion in potassium hydroxide, and an ethanolic solut …
The influence of etching time, temperature and intrinsic properties of the silicon substrate (e.g., orientation, crystallinity) on the basic process are studied. Fast preparation of porous silicon (PSi) was achieved on Si 〈1 0 0〉 at room temperature after only 30 s of exposure to etching solution.
In this article we introduce our chemical etching technique that is suitable for the investigation of the polyolefin microstructures.
After chemical etching of more than approximately one micrometer, the fused silica optics surface is almost free of metallic impurities (Ce, Al, Cu, Fe, etc.) induced by the polishing …
Etching is a method for material removal in many industrial processes. In microelectronics fabrication there must exist processes to selectively etch practically all the materials involved in the fabrication flow. That is, there must be a masking material that is relatively insensitive to the etching process.
A dry etching and/or wet etching process is used to etch the patterned wafer, which can vertically etch the unmasked silicon portion and a slight lateral under-etched masked portion to obtain a series of sharp silicon spikes, as shown in Fig.
The plasma etching is the removal process of materials performed by plasma, which is involved in the physical, chemical, and mixed etching mechanisms. The ion-enhanced chemical etching, i.e., reactive radical-dominated etching process with ion assistance is used in microelectronics and MEMS fabrication. The ICP (inductively …
The plasma etching (PE) is an absolute chemical etch process (chemical dry etching, CDE). The advantage is that the wafer surface is not damaged by accelerated ions. Due to the movable particles of the etch gases the etch profile is isotropic, thus this method is used to remove entire film layers (e.g. back side clean after thermal oxidation).
In this scenario, Metal-Assisted Chemical Etching (MACE) arose as an innovative synthesis method able to couple a CMOS cost-effective synthesis with a large-scale and microelectronics compatible …
Chemical etching, also known as "industrial etching" or "chemical milling", is a subtractive process in manufacturing. It involves the immersion or spraying of metals with temperature-regulated chemicals in order to remove specific areas in the metal to produce the desired shape, thickness and intricate designs or geometric features.
In this study, we successfully fabricated a mechanically robust, cost-effective, and easy-to-process superhydrophobic surface on an aluminum substrate using a two-step chemical etching process.
A new process of glass micro-prism structures is investigated by ultra-fast laser irradiation with chemical etching process. Ultra-fast laser is in use by one femtosecond laser system with amplifier as an excitation source for patterning the structures. Experimental results verified the high repetition rate of FS-laser and lower …
Theetching of silicate glasses in aqueous hydrofluoric acid solutions isapplied nmany technological fields. In this review most of the aspects of the wet chemical etching process of silicate glasses are discussed. The mechanism of the dissolution reaction is governed bythe adsorption of the two reactive species: HFand HF 2 andthe catalytic ...
This article looks at the chemical etching process, step-by-step, from material selection to dimensional inspection. Watch the video.
After chemical etching of more than approximately one micrometer, the fused silica optics surface is almost free of metallic impurities (Ce, Al, Cu, Fe, etc.) induced by the polishing process 8, 10.
Here, we present an alternative method for fabricating Si trenches using only wet chemical etching processes. A typical photolithography process was used to define the etching domain. Silicon nanowires (SiNWs) were etched in the selected area and removed by a chemical solution containing .
Chemical etching is a metal fabrication process for thin metal parts with complex or simple designs. Chemical etching, also known Photo etching, photo chemical, chemical machining, or chemical milling, is a multi-step process using a photosensitive material to transfer parts onto metal sheets. Then, a chemical etchant removes any unwanted …
Chemical etching uses acidic chemicals to remove material and create an etched pattern on a metal surface. This article delves into the fundamental processes of chemical …
The chemical transformations taking place during many of the reactions of the Si surface have been well documented, but the in situ dynamics of the reactions remain largely unexplored even for widely used electrochemical processes such as metal-assisted chemical etching (MACE). In this work, we design both n- and p-type Si …
Metallographic etching is the process of revealing microstructural details that would otherwise not be evident on the as-polished sample. The various etching processes are described.
Figure 3. Process flow of the metal-assisted chemical etching process used to generate the pillar structures used in this SandBox Studio: WeaveTM study.
Chemical etching of porcelain is common, but the images published in the literature are frequently over-etched. When glass is present in the grain boundaries of alumina, thermal etching can cause the glass to disappear or …
In order to investigate a possible effect of the chemical etch steps on the polysilicon layer that might influence the SEM images, a non-metallized polysilicon layer was exposed to …
Wet etching - substrates are immersed in a reactive solution (etchant). The layer to be etched is removed by chemical reaction or by dissolution. The reaction products must …
A wet etching process involves multiple chemical reactions that consume the original reactants and produce new reactants. The wet etch process can be described by three basic steps (1) diffusion of the liquid etchant to the structure that is to be removed and (2) the reaction between the liquid etchant and the material being etched away.
The collateral wafer surface material loss rate also increases by higher chemical flow rates, but the amount of total material loss actually reduces due to a greater reduction in the required process time. The fluid-kinetics enhanced selective etching process can cover a wider range of NiPt film conditions (5% Pt, up to 200 Å, 10% Pt up …
Then, insights into the various etching processes during precursor exfoliation into multilayer MXenes (henceforth known as the etching–exfoliation process) are highlighted.
Selective laser etching is a promising candidate for the mass production of glass interposers. It comprises two steps: local modification by an ultrashort-pulsed laser and chemical etching of the modified volume. According to previous studies, when an ultrashort-pulsed laser beam is irradiated on the sample, electron excitation occurs, …
